Data Platform Cloud Networking and AI in the Cloud
Intel’s Data Platform, Cloud Networking, and AI in the Cloud course is a comprehensive 3-week program that equips learners with essential knowledge in cloud computing, data management, networking, and artificial intelligence (AI). Here are the key components of this course:
- Data Platform:
- This module establishes a strong foundation and working knowledge of data fundamentals, including:
- Data mechanics: Understanding how data flows and interacts.
- Databases: Exploring different types of databases and their management.
- Data processing and analysis: Learning essential techniques for handling and analyzing data.
- Additionally, the course covers the relevance of Intel Architecture (IA) concerning data in the cloud.
- This module establishes a strong foundation and working knowledge of data fundamentals, including:
- Cloud Networking:
- In this segment, learners delve into network concepts, topology, and types of devices. Key topics include:
- Data center functions: Understanding the role of data centers in networking.
- Introduction to Intel® networking products and features.
- Exploring network architectures and best practices.
- In this segment, learners delve into network concepts, topology, and types of devices. Key topics include:
- AI in the Cloud:
- This module enhances learners’ ability to guide customers toward Intel Artificial Intelligence-based instances and services from major cloud service providers (CSPs) such as Azure, AWS, and GCP.
- Topics covered:
- Cloud AI trends: Understanding the evolving landscape of AI in cloud environments.
- AI-as-a-Service offerings: Summarizing what CSPs provide in terms of AI services.
- Benefits of Intel architecture in AI environments: Highlighting success stories using Intel-based instances.
Throughout the course, the focus remains on Intel products and services, ensuring learners gain practical insights into data platforms, cloud networking, and AI deployment. Expect approximately 6-7 hours of material weekly12.